As UV laser have good quality light beam and very small focusing spot so it can mark with high
precision and ultrafine effect. Most Materials can absorb UV light therefore the application is
wider than others. Small heat-affected zone and no thermal effect without burning.High marking
speed and efficiency. The whole unit have stable performance and small size with low power consumption.
1.The ambient temperature should be between 15-30 ℃ and air conditioning should be installed
2.The humidity requirement is < 60%. No condensation, dehumidifier should be installed
3.Power grid requirements:220V;50Hz
4.The fluctuation of power supply network: ± 15%, and the ground wire of power grid meets the international requirements.
Where the voltage amplitude is more than 15%, electronic automatic voltage and current stabilizing devices shall be installed;
5.There shall be no strong electromagnetic signal interference near the installation equipment. Avoid radio transmitting station
(or relay station) around the installation site
6.Foundation amplitude: less than 50um; vibration acceleration: less than 0.05g. Avoid a large number of stamping machine equipment nearby;
7.Equipment space requirements to ensure smoke-free and dust-free, to avoid metal polishing and grinding dust serious working environment;
8.Pressure:86-106kpa
9.Some environments should be equipped with anti-static floor, strengthen shielding, etc10.There are strict requirements for the water quality of working cooling circulating water. It is required to use pure water, deionized water
or distilled water. It is not allowed to use tap water, mineral water and other liquids containing high metal ions or other minerals
No Model ZXUV-3S 1 Laser Power 3W /5W 2 Laser Wave Lenght 355nm 3 Repetition frequency 10-200KHz 4 Engraving Area 110mmx110mm 5 Engraving Depth ≤0.1mm 6 Min character 0.06mm 7 Maximum machining speed ≤7000mm/s 8 Repeat marking accuracy ±0.01mm 9 Power Need AC220V/50Hz/10A 10 Cooling Mode Water Cooling (Industrial chiller can extend longer service life) 11 Overall Power 0.8KW 12 Software Professional Laser Marking Software SYSTEM DIMENSIONS 650 mm ×800mm ×1500 mm
INDUSTRY APPLICATION
Ø Logo of high end electronic products. Food, PVC pipes, pharmaceutical packaging materials (HDPE, Po, PP, etc.) marking, Ø Marking and scribing of flexible PCB. Ø Removal of metallic or non-metallic coatings. Ø Micro hole and blind hole processing of silicon wafer. PROCESSING SAMPLE PICTURE PCB scribing and marking Blind hole machining on silicon wafer Marking of gold plated parts
Marking of plastic packaging industry
PERFORMANCE PARAMETER
High end electronic products surface logo